In the field of material processing, ceramic parts are widely used in electronics, aerospace, machinery and other industries with their high hardness, high temperature resistance and corrosion resistance. However, their characteristics also bring processing difficulties. The following introduces common processing methods.
1. Cutting processing: precise shaping
Diamond cutting, diamond has high hardness. When cutting, the high-speed rotating cutting blade grinds the ceramic by surface particles, and can process various shapes, such as cutting ceramic circuit board substrates. However, cutting generates heat, which may affect the microstructure of ceramics, and the cutting speed and cooling conditions need to be controlled.
Laser cutting, which uses high-energy laser beams to melt or vaporize ceramics for cutting, has an accuracy of micrometers and can produce fine patterns of ceramic decorations. Moreover, non-contact processing does not produce mechanical stress. But the cost is high, and the efficiency is not high when cutting thick ceramic materials.
2. Grinding processing: improving surface quality
Mechanical grinding, which is a traditional surface processing method, relies on grinding discs and abrasives to rub the surface of parts under pressure to remove tiny protrusions to reduce roughness. Generally, different
particle size abrasives are used for step-by-step grinding. For example, when processing ceramic bearings, rough grinding is performed first and then fine grinding to improve the finish and extend the service life. This method has simple equipment and low cost, but the efficiency is not high and the technical requirements for operators are high.
Chemical mechanical polishing (CMP) combines chemical and mechanical effects. The chemical reagents in the grinding liquid react with the ceramic surface to form a soft layer, which is then removed by mechanical friction of the grinding pad to achieve surface flatness and polishing. It can achieve nano-level roughness and is often used in ceramic substrate processing in the semiconductor industry. However, the process is complicated and the grinding liquid composition, concentration, temperature, pressure and time parameters must be precisely controlled.
3. Molding processing: giving ceramic parts the initial shape
Dry pressing molding, putting the granulated ceramic powder into the mold and pressing it into shape, is suitable for making parts with simple shapes and large sizes, such as ceramic floor tiles. It is easy to operate and has high production efficiency, but it requires high mold precision, and uneven powder filling may lead to uneven density distribution of parts.
Injection molding, ceramic powder and binder are mixed into injection material with good fluidity, and then injected into the mold by injection molding machine. It can manufacture complex and high-precision parts, such as aerospace engine blades. However, the equipment cost is high, and the selection and removal process of binders need to be carefully designed.
Tape casting, ceramic powder and binder, plasticizer, solvent, etc. are made into a uniform slurry, and a film is scraped on the base tape with a scraper. After the solvent evaporates, it solidifies into a green film, which can be stacked multiple times and finally punched into a single green body. It is suitable for making large-area, uniform-thickness ceramic sheets, such as the dielectric layer of multilayer ceramic capacitors. However, the uniformity of the slurry and the accuracy of the scraper have a great influence on the quality of the green film.
There are many methods for processing ceramic parts, each with its own advantages and disadvantages and applicable scope. In actual processing, it is necessary to comprehensively select the appropriate method based on the specific requirements of the parts, material properties and cost factors to ensure the processing of high-quality ceramic parts.
-
Skype
